Damascene Steel

Microstructure Evolution in Damascene Interconnects

We have developed a 3-dimensional computer simulation tool to study the characteristics of microstructure evolution in damascene interconnects. This tool is based on the Monte Carlo method, and the characteristics of the microstructure evolution have a significant impact on the interconnect reliability. Our simulation results show that it may not be possible to obtain a bamboo microstructure th...

Mold Fabrication for 3D Dual Damascene Imprinting

Previously, a damascene process based on nanoimprint lithography has been proposed (Schmid G M, et al. in J Vac Sci Technol B 24(3) 1283, 2006) to greatly reduce the fabrication steps of metal interconnection in integrated circuit. For such a process to become a viable technique, a mold having two pattern levels with precise alignment between them must be fabricated first. To this end, this wor...

Damascene-patterned optical anisotropy in integrated photonics

We propose, simulate and experimentally demonstrate a method for realizing spatially-mapped birefringence onto integrated photonic devices and circuits. The fabrication method is based on applying a damascene-like process to dielectric film stacks to form anisotropic optical waveguides. An integrated polarizing beam-splitter (PBS) is realized with unprecedented performance: a record 0.52 octave...

Damascene Process and Chemical Mechanical Planarization )e

The constant demand to scale down transistors and improve device performance has led to material as well as process changes in the formation of IC interconnect. Traditionally, aluminum has been used to form the IC interconnects. The process involved subtractive etching of blanket aluminum as defined by the patterned photo resist. However, the scaling and performance demands have led to transiti...

Damascene Process and Chemical Mechanical Planarization